Postaje za Reballing BGA

Postaje za Reballing BGA

Postaje za Reballing BGA: professional reballing. 89+ na zalogi.

Postaje za Reballing BGA

Complete equipment for BGA reballing and rework: infrared stations, reflow ovens, PCB preheaters, direct and universal BGA stencils, solder balls in various diameters (0.2mm to 0.76mm), and reballing jigs. Brands such as Achi, LY, Scotle, and Infrared BGA. Professional solutions for GPU, chipset, and processor repair on consoles and laptops.

What do I need for GPU and BGA chip reballing?

For BGA reballing you need: a hot air or infrared station with precise temperature control, a PCB preheater to prevent warping, specific BGA stencils for the chip being repaired, solder balls of the correct diameter (usually 0.5mm or 0.6mm for GPUs), BGA flux (such as Amtech), and a reballing jig or fixture. For console chips (PS3, Xbox 360), direct stencils greatly simplify the process.

1-15 od 118 rezultatov

Samsung S3 IC stencil plošča za popravila in natančno BGA spajkanje

3,66
Na zalogi je samo še 7

Srednja antistatična krtača tip 7 za reballing Mlink

2,44
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Stencil plošča IC iPhone 5C za BGA reballing Mlink

3,66
Na zalogi je samo še 3

Stencil plošča iPhone 4S za BGA spajkanje - natančna šablona Mlink

3,66
Na zalogi je samo še 4

Stencil plošča iPhone 6 za BGA spajkanje in natančno popravilo

3,66
Na zalogi je samo še 6
Stencil plošča Samsung Note 4 za IC reballing - profesionalno orodje Mlink
-4%

Stencil plošča Samsung Note 4 za IC reballing - profesionalno orodje Mlink

3,51 3,66 €
Na zalogi je samo še 2

Stencil plošča Samsung Note 5 za IC reballing z natančnostjo

3,66
Na zalogi je samo še 1

Stencil plošča Samsung S5 za BGA reballing z orodjem Mlink

3,66
Na zalogi je samo še 8